DBC (Direct Bonded Copper) Substrate is a special process board where copper foil is bonded directly to the surface (single or double sided) of and AI203 OR AIN ceramic substrate at high temperatures and can be etched with various graphics. It has excellent electrical insulation performance, high thermal conductivity, excellent soft brazability, high adhesion strength and a large current-carrying capacity. DBC Substrate mainly used in the fields of rail transit, smart grid, new energy vehicles, industrial frequency conversion, household appliances, military power electronics, wind and photovoltaic power generation.
We custom high precision DBC Substrate with drawings provided by customers. The raw material we use for etched DBC substrate is Ceramic-based double-sided copper clad laminate. We are equipped with professional metal etching equipment and exposure development equipment. Our etching process can achieve double-sided etching of different graphics with 0.3 mm - 0.8mm thickness of copper clad laminate. Also, we can guarantee that our double-sided copper clad laminate substrate is neatly arranged, straight surface line, and have no burr, high product accuracy.
Its superiorities of DBC Substrate are as follow:
1. A ceramic substrate with a coefficient of thermal expansion close to that of a silicon chip, which saves the transition layer of Mo chips, saving labour, material and cost.
2. Excellent thermal conductivity, making the chip package very compact, thus greatly increasing the power density and improving the reliability of systems and devices.
3. A large number of high-voltage, high-power devices have high requirements for heat dissipation, and ceramic substrates have a better heat dissipation effect.
4. Ultra-thin (0.25mm) ceramic substrates can replace beo, without environmental toxicity problems.
5. Large current carrying capacity, 100A continuous current through 1mm wide 0.3mm thick copper body, temperature rise of about 17 ℃; 100A continuous current through 2mm wide 0.3mm thick copper body, temperature rise of only about 5 ℃.
6. High insulation withstand voltage, to ensure personal safety and equipment protection
7. New packaging and assembly methods can be realized, resulting in highly integrated products and reduced size
8. The ceramic substrate is highly resistant to vibration and wear, ensuring its long service life.
High Precision DBC Substrate,Etched DBC Substrate,Double-Sided Copper Clad Laminate Substrate SHAOXING HUALI ELECTRONICS CO., LTD. , https://www.cnsxhuali.com
According to a report by Fan Guanghan, a professor at the Institute of Optoelectronic Materials and Technology of South China Normal University, in the field of LED packaging, China's number of original patent applications is ahead of other countries, followed by Japan, and the United States and South Korea rank third and fourth. The research and development strength of LED packaging in foreign countries is not only concentrated on the structure, but also has a strong research on packaging materials. China is mainly focused on the design of LED package structures. When a better material is used, it is easy to be controlled by people.
In addition, foreign applications in packaging technology and structure focus on quality. Once high-quality patents are available, they will apply for patents of the same family to various countries through PCT and other channels, and China is their main target market. From the domestic structure of most thermoelectric separations in the country today, it can be seen that the number of applications for packaging structures in China is very large, but it has not gone to the world. From some perspectives, it can be seen that the quality of its own patents Not confident.
The world's top 10 Philips, Samsung, Career, LG, Panasonic and other well-known manufacturers, applied for a total of 5,263 patents, this is the applicant's future is still the main competitor in the packaging field. In contrast, Chinese applicants, the top three are Taiwan Everlight Electronics Industry Co., Ltd., Hongqi Technology Co., Ltd. and Yiquan Precision Industry Co., Ltd., accounting for 18%, 13% and 11 of China's top 10 applications respectively. % indicates that Taiwan has a good strength in the field of packaging. In the future, Taiwan's LED package counterparts are still strong competitors. The top 6 patent applicants in the mainland are Heshan Lide Electronic Industry Co., Ltd., Foshan Guoxing Optoelectronics Co., Ltd., Tsinghua University, University of Electronic Science and Technology, Guangzhou Nanke Integrated Electronics Co., Ltd., and Rainbow Group.
The report also shows that in the field of MOCVD, from the application trends of the five major original countries or regions in the United States, Japan, South Korea, Germany, and Taiwan, all three countries and regions except the United States and Japan started earlier. It was applied in the mid-1990s. Although these five countries and regions have started relatively early, the overall patent situation has been consistent since 2000, and the number of applications has increased rapidly.
China started relatively late, and the number of patents in this field is still small. The originality and quality are not ideal, and there is no advantage. Germany AIXTRON, the United States VEECO has a leading position in MOCVD technology, accounting for 90% of the world's market share, its core patent covers the design of the growth chamber, heating, stage design, etc., both in China and around the world Patent layout is the core technology point of MOCVD equipment. 
After July of this year, Guangdong once again opened the patent analysis and early warning of LED package MOCVD equipment. Recently, the core patent analysis and early warning report of the province's LED industry packaging and MOCVD equipment held by the Guangdong Provincial Intellectual Property Office was held in Zhongshan.