The global LED packaging industry is mainly concentrated in China, East Asia, the United States, Europe and other countries and regions. In recent years, benefiting from cost advantages and strong demand for downstream products, China has gradually taken over the global industrial transfer and has become the world's most important LED packaging production base. According to data from the Institute of Advanced Industrial Industries (GGII), the size of China's LED packaging market in 2016 increased from RMB 64.4 billion in 2015 to RMB 73.7 billion, a year-on-year increase of 14%. In 2017, driven by the LED application market, especially the LED lighting market recovery and strong demand in the niche market, GGII expects China's LED packaging market to reach 87 billion yuan in 2017. As an indispensable part of the entire LED industry chain, LED packaging materials have experienced another round of impact in the continuous wave of reshuffle in the packaging market. In particular, LED glue, from the price war to the patent war, to the competition segment, has been subject to the market's "experience." Qian Xuexing, general manager of Morning Technology, said, “The overall market for glue is in an incremental state this year. With the expansion of the major packaging companies, the demand for glue has increased. However, due to the environmental rectification in the second half of the year, Many small and micro silica raw material enterprises have closed down for business, and the price of silicone raw materials in large enterprises has skyrocketed, and customers are required to order in cash, which brings a lot of cost and financial pressure to the glue enterprises. Of course, this is also a market reshuffle opportunity, some small Glue enterprises will be more difficult in this market environment, and to some extent, provide us with more development opportunities for companies with independent brands, research and development strength, and financial strength." Layout COB glue, patch glue on the standard road Corning Chenri Technology is a state-level high-tech enterprise in the field of electronic fine chemicals. It is committed to the research and development and production of semiconductor packaging materials, LED packaging materials and electronic assembly materials. It currently has 5 invention patents and 7 utility model patents. It is understood that the earliest cutting into the LED market is starting from SMT solder paste and solid crystal solder paste. Gujing solder paste is also the original material technology in the LED field, and has been at the leading level in the industry. After rapid development in recent years, it has already occupied more than 80% of the domestic LED flip chip solder paste market, and has been recognized by major domestic LED packaging manufacturers with high quality and reasonable price. After successfully developing solid-state solder paste in 2011, Chenri Technology saw that the follow-up market scale of LED packaging rubber will continue to expand, and in the first year of COB development in 2012, it successfully launched the dam glue. Although the dam rubber is a small part of the COB package, after taking most of the domestic COB packaging customers, Morning Technology is more confident in the next step of developing silica gel materials. Therefore, Chenri Technology has built a research and development team consisting of doctors and masters, specializing in the development of LED silica gel, and successfully launched filament glue, COB glue, and patch glue. According to Qian Xuexing, “The filament rubber has passed the market quality inspection from 2015 to 2017, and now it has been recognized by the top three companies in the domestic filament packaging, and the future development prospects are promising.†In fact, there are already large-scale enterprises in COB glue and patch glue in China. Although the intervention of Science and Technology in the morning is relatively late, it has been pursuing “intensive cultivationâ€, keeping pace with the transformation of industrial technology, with stable quality as the core. The best cost performance for customers has been purchased by many companies in bulk. The high-power COB glue is a two-component addition silicone encapsulant, which is mainly suitable for powder mixing and potting of high-power COB/integrated module surface light source. Its advantages are mainly reflected in the following three points: 1, good leveling, easy to inject glue; 2, after curing, leveling, light source, no bubble, and PPA, silver plated bracket, white oil plate, mirror aluminum, ceramic substrate have good bonding performance; 3, the expansion coefficient is small, the heat resistance is excellent, after 300 °C long-term aging, no cracking, no shrinkage, no yellowing. It is worth mentioning that the high-temperature COB adhesive developed by Chenri Technology is comparable to the Dow Corning 7340, and performs slightly better than the 7340 in the 300° high temperature environment. “As the saying goes, good steel is equipped with a good knife.†The same is true for LED light sources, which require good glue to build. As far as LED lights are concerned, with the rapid development of the market, the requirements for high-power COB glue are also significantly improved, such as flip-chip lights, high power, high heat, so the melting point of the solder paste and the high temperature resistance of the colloid A series of new parameter requirements have been proposed, and for these requirements, Morning Technology can provide excellent solutions. Qian Xuexing said frankly, "We have always asked engineers to "go out" and personally go to the application site to understand the individual needs of customers and solve problems in a "peer-to-peer" way. Our service tenet is that as long as customers have problems, we will do our best. Go and solve it." Continuous research and development, initiative to reduce costs As an important auxiliary material for LED packaging, glue also accounts for the proportion of packaging cost. In order to reduce the cost of LED packaging and reduce the purchase price of accessories such as glue, it has become one of the important ways for packaging companies to reduce costs. Therefore, packaging materials companies are facing a situation in which profit margins are shrinking, and survival is becoming increasingly difficult. According to the person in charge of the packaging company, downstream manufacturers have continued to reduce the price of packaged devices. This also indicates that in addition to internal digestion, the cost of the material must be cut again. The price of ordinary packaged silica gel is inevitable. In the face of impact, glue companies looking for new profit growth points, the transfer to high-margin products is imperative, many glue companies have begun in filament glue, high temperature COB glue, high power (1 watt or more) high temperature 2835 patch glue And other subdivision areas to tighten the layout. As far as the current market situation is concerned, both COB adhesives and patch adhesives are relatively large-volume markets. “COB has high power and low power, and there are also differences between aluminum substrates and ceramic substrates. This also leads to a variety of market demands for COB silica. Our high-power COB adhesive 9318-5 is able to optimize the customer's right to mark the Dow Corning 7340. Cooling and cost reduction requirements.†Qian Xuexing told Gaogong LED. LED SMD encapsulant is a two-component thermosetting silicone encapsulant, which is mainly suitable for packaging various types of LED patches. The patch adhesive adopts unique MDT resin structure design, and has good adhesion to PPA and aluminum substrate silver plating layer, and has high purity, high refractive index, high resistance to vulcanization, high resistance to thermal shock and the like. Qian Xuexing said, “Spread glue is the same as COB glue. The most worrying customers are quality stability and price. Especially the largest 2835 market is particularly competitive. Most customers have extremely strong cost demands. The 'latecomers' will actively reduce the cost of the patch glue and give the customer an expected cost target." Target to squeeze into the top three domestic silicones in the next three years Once upon a time, in the battle for domestic LED packaged silica gel, Dow Corning, Shin-Etsu and other international giants took advantage of the brand advantage and product technology to lead the city. In recent years, domestic glue has also achieved leap-forward progress in the rapid development in recent years, and has been continuously improved and innovated in technology, occupying a certain market share. Next, with the rapid rise of the domestic LED lighting market, the demand for glue as the core of the packaging will also rise. Morning Technology is also aiming at the opportunity to "do things", hoping to re-energize the market and gain more market share. "We are striving to give full play to the research and development advantages of a package of material solutions and the point-to-point technical service awareness on the basis of the market leading of Gujing solder paste, dam glue and filament glue, and go all out to do the COB glue and patch glue market. Holding the concept of creating value for customers, we strive to be among the top three in China within three years." Qian Xuexing finally mentioned. Honeywell Barcode Scanner Battery honeywell scn01 battery,honeywell eda50k battery,eda50k battery,honeywell scanner battery,battey for honeywell Shenzhen Sunwind Energy Tech Co.,Ltd , https://www.sunwindbatterylm.com
