Solar cell offers as low as $1.15

Solar cell manufacturers still fear the price reduction in December, and revenue continues to record high performance. After the market pays attention to whether the production capacity can also offset the pressure of price drop, according to PVinsights' survey of solar energy pricing agencies, the price is falling. Part of the pressured solar cells, the average price per watt in the first week of 2011 was US$1.195 per watt, a decrease of US$0.005 from the previous week, and a 0.42% drop from the week, but the lower price has also come to US$1.15. New low price recently.

Solar manufacturers are still quite optimistic for 2011. Batteries and Tantalum fabs have maintained a relatively high capacity utilization rate and built high inventory. Therefore, even without a strong solar system installation, the solar energy prices in the first week of 2011 have only declined slightly. However, PVinsights expects prices to decline further in late January in quiet and weak solar demand and manufacturers still increase inventory.

The prices of upstream polycrystalline silicon continued to decline. This week's quoted price slipped by 1.39%. The average price fell by 1 US dollar to US$71/kg. In solar wafers, the quoted price declined sharply. Each 6-inch polycrystalline silicon wafer was The price of about 3.58 US dollars, the average price of 6-inch single crystal silicon wafers fell to 3.78 US dollars, the weekly decline of about 0.56% and 0.53%.

According to market assessments, solar cell prices are subject to downward pressure, and as battery makers cut prices to grab the market, low-cost strategies will boost the volume of energy and make upstream wafer demand stable. However, the Q1 solar power industry related supply chains have downward pressure on prices.

PGA Sockets Adapters

PGA Sockets Pin Grid Array Socket
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).

PGA Sockets & Adapters
Low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint can be accommodated, including interstitial patterns.

PGA Sockets & Adapters Overview
Durable construction for virtually any application
Wide variety of materials, lengths, and sizes
Cost-effective method for replacing, repairing, or upgrading PGA devices
Unique options such as solder preform terminals eliminate the need for wave soldering in mixed SMT/Thru-hole applications
RoHS compliant insulators and screw-machined terminals are compatible with lead-free processing - select either Matte Tin/Gold (MG) or Gold/Gold (GG) plating

Antenk's Pin Grid Array (PGA) Sockets
Complex printed circuits are too valuable to risk direct soldering to expensive integrated circuits (ICs). Using a socket is the answer. The use of sockets offers advantages that prove cost effective and simplify board design.

Antenk's processor socket line is designed for use with Intel- and AMD-based microprocessor packages. Socket types include land grid array (LGA), micro pin grid array (mPGA), and PGA with low to zero insertion force. The mPGA and PGA sockets are designed for various microprocessor packages for notebook PCs, desktop PCs, and servers. For custom applications, the compression sockets can be configured to the specific application.

mPGA/PGA (ZIF)
These sockets provide a zero insertion force (ZIF) PGA interface to the microprocessor PGA package and are attached to the PCB with surface-mount technology (SMT) soldering. PGA sockets are available in arrays up to 989 positions with single lever, screw driver, and hex wrench actuation methods.
PGA Sockets (LIF)
These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts. Custom arrays are available in more than 1,000 positions.

Pin Grid Array (PGA) Sockets Type
mPGA
PGA

PGA

PGA Sockets Typical Applications:
Eliminate hand-loading of pins, facilitate solder joint visibility, low profile component mounting or board mating.

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