ã€Global Network Technology Report】 According to Anandtech, a well-known hardware assessment site, on December 5th, AMD's surprise appearance at the Qualcomm Snapdragon Technology Summit and the sudden appearance of AMD's customer service department general manager Kevin Lengxin were invited to announce that AMD had reached an agreement with Qualcomm. Connectivity partnership. Recently, AMD announced a new high-performance x86 CPU core and the latest notebook GPU architecture. AMD Rui Long 7 2700U internal wave factor 15W, there are 4 Zen cores and 10 Vega computing units. At the press conference, Hewlett-Packard, Acer and Lenovo briefly introduced three notebook computer designs, including the Hewlett-Packard Microchip x360 with the Rui Long 5 2500U processor. Kevin announced at the Qualcomm conference that AMD and Qualcomm have collaborated on the LTE connectivity upgrade of the mobile platform. In general, when a supplier creates a laptop or smartphone platform, it needs to create a series of reference designs and send it to the original equipment supplier. These designs should show how each part is assembled and what technology is used. Kevin explained that the Dragon's mobile reference platform is equipped with a Qualcomm LTE modem to guarantee mobile connectivity during operation. Laptops with mobile connectivity are not new. Intel has implemented its own proprietary modems for many years, mostly for business terminal devices or Chrome laptops. In fact, AMD's actions have made matters even more of a concern. Kevin said on the stage that some original equipment suppliers are interested in Qualcomm's LTE connectivity. Therefore, commercial or personal use of Ruilong mobile design may indeed be equipped with LTE. However, the problem is also obvious, such as additional costs, operator relationships, and extra energy consumption. These issues may be discussed at next month's Consumer Electronics Show in the United States, where everyone involved will provide up-to-date information on new listings. (Internship Compilation: Wang Xiongfei reviewer: Li Zongze) Specifications
pack coins into small plastic bag,Coin Sachet Machine,Coin bagging Suzhou Ribao Technology Co. Ltd. , https://www.ribaoeurope.com
Counting speed
≦1500pcs/min(For coins with a diameter of 25mm)
Diameter
14-34.0mm
Thickness
0.8-3.8mm
Hopper capacity
4000pcs
Packing/wrapping speed
≦15packages/min(For coins with a diameter of 25mm.)
Package way
Hot iron
Packing bag size
Length:100-140mm, Width:100mm
Operation interface
HMI
Driving mode
Electric
Power requirements
AC 220-240V 50Hz
Current
AC 6A
Power consumption
1.2KW
Noise
< 70dB
Control system
PLC XC5-32T-E/C