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This 33,259-square-meter facility is adjacent to the existing TI Chengdu wafer fab and will be TI's seventh package and test site worldwide. Chengdu will become TI's only manufacturing base integrating end-to-end wafer fabrication, packaging and testing.
TI will immediately begin to update equipment and facilities in the acquired plant and operate a small production line. Based on its commitment to environmental protection in its global production activities, TI will prioritize how to reduce water and energy use and reduce waste emissions during the refurbishment process. TI plans to complete the packaging and test manufacturing base in the fourth quarter of 2014 and put it into production.
This investment plan will not change TI's 2013 capital expenditure forecast. The company's capital expenditure level will continue to be maintained at 4% of annual operating income. When the company's annual operating income exceeds $18 billion, the company's long-term capital expenditure will be between 4% and 7% of annual operating income. 
Based on the investment plan announced earlier this year, on December 20th, Texas Instruments (TI) announced the acquisition of UTAC Chengdu's plant in Chengdu High-tech Industrial Development Zone, further strengthening its long-term investment strategy in this important region. Earlier this year, TI announced that the total investment in these projects over the next 15 years is expected to be up to $1.69 billion, or about 10 billion yuan.