SIP packaging technology, China's development is urgently needed

Industrial and consumer electronics have greater demand

As IC devices continue to shrink in size and computing speeds continue to increase, packaging technology has become a critical technology. The advantages and disadvantages of the package form have affected the frequency, power consumption, complexity, reliability and unit cost of IC devices. Especially when miniaturization and low power consumption of industrial and consumer electronic products are urgently needed, a new packaging technology is urgently needed. .

The SIP three-dimensional package integrated circuit industry is an emerging important branch of the entire integrated circuit industry and an important development direction. Since the industry is still in the initial stage of development, domestic and foreign packaging companies are basically on the same starting line. This provides a rare opportunity for domestic packaging companies to develop. Up to now, SIP three-dimensional packaging technologies, including Jiangsu Changdian, Nantong Fujitsu, Wuxi China Resources Ansheng, and other domestic packaging companies have matured, but most enterprises are also limited by capacity. As a result, this has spawned some devices to invest in the establishment of advanced SIP packaging production lines, more differentiated and improved value-added services for their own electronic devices, such as Zhuhai Obit, Lai King, Shanghai Perth High Company, their SIP packaging Technology is in an international leading position.

SIP three-dimensional packaging technology meets the urgent needs of high-end devices in China's aviation, aerospace and defense fields

With the rapid development of technology in the field of computer network communication, China's aerospace, defense electronics and other fields have urgent market demand for high reliability, high performance, miniaturization, long life SOC, SIP and other products, but these products still rely mainly on imports. . Moreover, some high-performance chip products have long been in a state of being technically blocked and embargoed by foreign countries. In the new era, national defense electronic equipment puts forward new requirements for computer system chips of multifunctional and miniaturized electronic whole machines, and must meet the conditions of multi-functionality and miniaturization.

According to Huang Xiaohu, deputy general manager of the company, it is possible to meet this requirement through the following two channels. One is SoC (System-on-chip), a system-on-a-chip that integrates digital circuits, analog circuits, RF, memory, and interface circuits on a single chip to implement image processing, voice processing, communication functions, and data. Handling and other functions. The other is SiP (System-in-package), a system-in-package that combines multiple IC chips and various electronic components (such as discrete components and embedded components) in one package to achieve the same level as SoC. Multiple functions.

To this end, Zhuhai Obit Company launched the research and development of the special SIP three-dimensional packaging process in 2008, with the aim of fundamentally solving the situation that China's aviation, aerospace and weapon system electronic equipment core technology is subject to people's situation, through the development of high performance High-reliability, miniaturization, anti-irradiation large-capacity memory chips, dedicated module chips, and embedded computer system module chips, breaking the technical blockade and product embargo imposed by China on foreign countries, ensuring safety, controllability and advancement .

Nowadays, this electronic device, which is specially designed for the special electronic equipment SIP three-dimensional packaging technology, has a reliable mass production level and is widely supplied to customers.

SiP technology helps create a life-friendly wearable device

SIP packaging technology is not a patent for industrial applications. In fact, small consumer electronic products represented by mobile phones are a broad stage for SIP packaging technology.

Mobile technology is becoming more and more diverse. Watches, glasses, bracelets, rings, clothes and other different forms of personal products, in addition to glamorous accessories, in the breakthrough of system miniaturization technology and the integration of application software, can make more More intelligent features are hidden in the original size space of the object.

Zhou Rucong, associate director of Vision SiP, said that system-in-package (SiP) miniaturization technology can optimize the small size of wearable devices, making the device more suitable for everyday use. For example, in the past, the concept of a wearable display equipped with micro-projection was introduced 10 years ago. However, the size of the device was too large, and the network was not developed and there was no suitable matching platform. Therefore, it was not a highlight product at that time. Nowadays, with the SiP system miniaturization design, it can integrate various functions on the wearable device, and can increase the portability, wireless and immediacy of the product without changing the appearance to create intelligent use. Value, and SiP has become the core technology for wearable devices to enter life.

At present, when the system factory designs intelligent wearable devices, the main challenge is how to put all the required functions into a very small space. Taking smart glasses as an example, in the hardware design part, it is necessary to consider the characteristics of the main components such as wireless communication, application processor (AP), storage memory, photographic lens, micro-projection display, sensor, microphone, etc., and also to evaluate Compatibility and overall operational performance after components are integrated into the system board. The integration of SiP miniaturization system can simplify the system design and meet the miniaturization features of the device in a multi-component integration mode, which can greatly benefit the wearable devices that require size, weight and versatility at the same time.